Facilities
Leepra Introducing Delvitech 3D AOI: Revolutionizing Quality Control
Delvitech 3D AOI is a cutting-edge automated optical inspection system designed to transform your quality control process. Our innovative solution utilizes advanced 3D imaging technology to detect defects and irregularities on the surface of materials, components, and products with unparalleled accuracy and speed.
This innovative system boasts high-resolution 3D imaging capabilities, ensuring precise defect detection. Its advanced algorithms enable accurate analysis and classification, facilitating real-time inspection and reporting for swift decision-making. With customizable settings, it allows tailored quality control solutions and seamless integration with existing production lines and workflows. The benefits are manifold: enhanced product quality and reliability, reduced inspection time and costs, increased production efficiency and yield, improved customer satisfaction and loyalty, and ultimately, a competitive advantage in your industry.
Applications Of Delvitech 3D AOI
Electronics manufacturing (PCBs, components, etc.)
enhances electronics manufacturing efficiency through precise defect detection and real-time quality control.
Automotive parts inspection
streamlines automotive parts inspection with high-resolution imaging and real-time analysis
Aerospace components inspection
ensuring stringent quality standards and regulatory compliance
Medical device manufacturing
ensuring adherence to rigorous quality standards and regulatory requirements
Consumer goods quality control
revolutionizes consumer goods quality control with state-of-the-art imaging and analysis
Leepra Tied-Up Facilities
Designing
Revolutionizing electronics through innovative design solutions.
R & D
Pioneering advancements in electronics through cutting-edge R&D.
PCB Fabrication
Precision-driven PCB fabrication for seamless electronic integration.
Mechanical
Innovative mechanical engineering solutions driving electronic excellence
Our Manufacturing Facilities
LeePra provides a full range of Electronics Manufacturing Services (EMS), ensuring end-to-end solutions for all your electronic production needs. We specialize in Surface-Mount Technology (SMT) and Through-Hole (TH) assembly, which enable us to handle both high-density, complex circuit boards as well as traditional, robust components. Our advanced testing facilities guarantee the highest quality and reliability of your products, with thorough inspection and validation processes.
In addition to our core EMS offerings, we support the production of custom cable assemblies and wire harnesses, designed to meet your specific requirements and ensure seamless connectivity within your systems. Furthermore, we excel in mechanical integration, allowing us to assemble and integrate mechanical components with electronic systems to deliver complete, functional products ready for market. Our integrated approach ensures that all aspects of your project are managed under one roof, providing you with a streamlined production process and a single point of contact.”
This version expands on the capabilities and benefits of each service, offering more context and emphasizing the comprehensive nature of your offerings.
| Prototype | Rapid Prototype Transformation | |
| PCBA SMT and TH Equipments | 1. High-speed and high-accuracy ASM and Fuji SMT production lines | |
| 2. Automatic wave-soldering and manual soldering lines | ||
| PCBA Capacity | SMT Capacity: 5 million components per day | |
| TH Line Capacity : 0.25 Million per day | ||
| Components Service | Turnkey | LeePra’s comprehensive and trustworthy supplier network enables us to procure high-quality components at cost-effective prices. |
| Jobwork , Kitted or Consigned | Components Supplied by the Customers, Assembly Executed by LeePra | |
| PCBA Solder Type | SMT, THT, single or double side PnP | |
| Component Size | Minimum Package | 01005 chip size |
| Minimum BGA Spacing | 0.3mm(ball to ball) | |
| Minimum Fine Pitch | 0.25mm (X-ray available to ensure the solder quality) | |
| Component Package | We accept tape and reel, tube, and tray packages for components | |
| Maximum Mount Accuracy of Components (100FP) | ±50 μm | |
| Solderable PCB Type | Rigid PCB, FPC, Rigid-Flex PCB, Aluminum PCB | |
| PCB Size | Min PCB size：50mm x 50mm （boards under this size will be panelized） | |
| Max PCB size: 360mm x 450mm | ||
| We conduct a range of tests on the mounted or pre-mounted PCBA to ensure quality before shipment. | ||
| Testing and coverage | Inward Quality Control | Inspect incoming components to ensure they match the BOM and datasheet requirements. |
| Online AOI inspection | 100% AOI inpsection will be done | |
| X-Ray inspection | Inspect the solder joint of BGA, QFN, and other high-precision components which are invisible to human-eye | |
| Functional Testing | As per the Customer Requirements | |
Connect with LeePra For
Electronic Manufacturing Solution
Experience the difference with LeePra Technologies: Unleashing innovation and excellence in electronic manufacturing for unparalleled Services.